Method for manufacturing multilayer electronic component
AssigneeTDK Corporation
InventorsJun Sato, Yukari Wada, Koki Shinozawa
Life of this patent
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Abstract
A method for manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated. The green multilayer body 11 is formed on the temporary holding film 62 formed on the release substrate. The green multilayer body 11 is formed by repeating the first step forming a green functional part using the first ink containing the functional particles and the second step forming the green conductor part using the second ink containing the conductive particles. The temporary holding film 62 has conductivity.
Claims17
A method for manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated, comprising
- a step of forming a green multilayer body on a temporary holding film, wherein
- the green multilayer body is formed by repeating a first step of forming a green functional part using a first ink containing a functional particle and a second step of forming a green conductor part using a second ink containing a conductive particle,
- the temporary holding film has conductivity,
- the first ink and/or the second ink is ejected by an ejecting apparatus,
- the temporary holding film contains particles having conductivity in a resin film,
- particle diameters of the particles having conductivity are from 0.02 to 2 μm, and
- a volume percentage of the particles having conductivity is from 30 to 80 volume %.
A method for manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated, comprising
- a step of forming a green multilayer body on a temporary holding film, wherein
- the green multilayer body is formed by repeating a first step of forming a green functional part using a first ink containing a functional particle and a second step of forming a green conductor part using a second ink containing a conductive particle, and
- the temporary holding film has conductivity and any of (i) a breaking strength of 1 N/m or more, (ii) a break elongation of 3% or more, or (iii) a porous structure,
- the temporary holding film contains particles having conductivity in a resin film,
- particle diameters of the particles having conductivity are from 0.02 to 2 μm, and
- a volume percentage of the particles having conductivity is from 30 to 80 volume %.
A method for manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated, comprising
- a step of forming a green multilayer body on a temporary holding film, wherein
- the green multilayer body is formed by repeating a first step of forming a green functional part using a first ink containing a functional particle and a second step of forming a green conductor part using a second ink containing a conductive particle,
- the temporary holding film has conductivity,
- (i) the green functional part and the green conductor part each have a separated pattern corresponding to the shape and size of the element body after firing and/or (ii) the green functional part and/or the green conductor part is formed by an electrostatic attraction method,
- the temporary holding film contains particles having conductivity in a resin film,
- particle diameters of the particles having conductivity are from 0.02 to 2 μm, and
- a volume percentage of the particles having conductivity is from 30 to 80 volume %.
A method for manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated, comprising
- a step of forming a green multilayer body on a temporary holding film, wherein
- the green multilayer body is formed by repeating a first step of forming a green functional part using a first ink containing a functional particle and a second step of forming a green conductor part using a second ink containing a conductive particle,
- the temporary holding film has conductivity,
- the temporary holding film contains particles having conductivity in a resin film,
- particle diameters of the particles having conductivity are from 0.02 to 2 μm, and
- a volume percentage of the particles having conductivity is from 30 to 80 volume %.
Dependencies are inferred from the claim text.