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US 10,994,387 B1Granted
Fabrication of flexible conductive films, with semiconductive material, formed with rubbing-in technology for elastic or deformable devices
AssigneeKing Abdulaziz University
InventorsMuhammad Tariq Saeed Chani, Abdullah Mohamed Asiri, Hasan Karimov
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Abstract
Rubber composites with regions doped with conductive material, e.g., carbon nanotubes, and patterned regions doped with both conductive material and semiconductive material, e.g., carbon nanotubes and polcrystalline silicon are created with rubbing-in technology. The composites provide for a deformable and elastic composite which maintains semiconductor operations under stress, and can be used for filtering, determining compressive force, and a variety of other applications.
Claims14
A method for preparing a deformable,
- semiconductive, composite, comprising:
- stretching a rubber substrate;
- applying a first powder of a first conductive material to a surface of the substrate while the rubber substrate is stretched;
- rubbing the first powder of the conductive material into the surface of the substrate using a loading device which applies pressure on the first powder against the surface and which moves in a plurality of directions across the surface, wherein rubbing produces an embedded region of the conductive material in the surface of the rubber substrate, wherein rubbing the first powder is performed while the rubber substrate is stretched;
- removing one or more portions of the embedded region so as to remove the conductive material in the one or more portions and associated rubber in the one or more portions of the embedded region so as to expose one or more regions of the rubber substrate where the one or more portions were removed;
- applying a second powder comprising a second conductive material and a semiconductive material in the one or more regions of the rubber substrate where the one or more portions were removed while the rubber substrate is stretched;
- rubbing the second powder into the one or more regions of the rubber substrate where the one or more portions were removed using the loading device which applies pressure on the second powder against the surface and which moves in a plurality of directions across the surface, wherein rubbing the second powder is performed while the rubber substrate is stretched;
- and
- relaxing the stretch on the rubber substrate to produce the deformable, semiconductive, composite, wherein the deformable, semiconductive composite, comprises a first portion which is rubber which is not doped with the first conductive material, the second conductive material, or the semiconductive material, a second portion which comprises rubber doped with the first conductive material, and one or more third portions which comprises rubber doped with the second conductive material and the semiconductive material.
6 more elements
Dependencies are inferred from the claim text.