Carbon-based direct plating process
AssigneeMacDermid Enthone Inc.
InventorsRoger Bernards, James Martin, Jason J. Carver
Life of this patent
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Abstract
A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.
Claims16
A method of preparing a non-conductive substrate to allow metal plating thereon, the method comprising the steps of:
- a) conditioning the non-conductive substrate with a conditioning agent, wherein the conditioning agent comprises at least 10% by volume of a conditioner having a molecular weight of at least 1,000,000 g/mol;
- b) applying a liquid carbon-based dispersion to the conditioned non-conductive substrate to form a carbon coating on the conditioned non-conductive substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution, wherein the carbon particles coagulate onto the conditioned non-conductive substrate to form a carbon/conditioner gel coating;
- and
- c) etching the substrate,
- wherein the etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.
Dependencies are inferred from the claim text.