Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

A molded circuit board assembly for a camera module, comprising:

• at least one circuit board, which comprises:
• a base board;
• one or more electronic components on said base board;
• at least one photosensitive element provided on said at least one circuit board, wherein said at least one photosensitive element has a photosensitive area portion and a non-photosensitive area portion surrounding said photosensitive area portion;
• and
• one or more connecting elements electrically connecting said non-photosensitive area portion of said at least one photosensitive element with said at least one circuit board;
• and
• at least one molded base which is integrally formed with said at least one circuit board, wherein said at least one molded base is molded to encapsulate and bury said one or more electronic components on said base board of said at least one circuit board therein and forms at least one light window which provides a light path for said at least one photosensitive element for enabling a light reaching said at least one photosensitive element through said light window, wherein said at least one molded base has an annular inner side surface which has at least a portion inclinedly extended from said circuit board and an annular outer side surface extended upwardly and inwardly from said base board of said at least one circuit board, wherein said inner side surface of said molded base is inclinedly, upwardly and outwardly extended from said non-photosensitive area portion of said at least one photosensitive element, wherein said molded base is molded to encapsulate and bury said one or more electronic components on said base board of said circuit board therein and forms at least one light window which provides a light path for said photosensitive element for enabling a light reaching said photosensitive element through said light window.