US 10,985,040 B2 · Substrate treatment method and substrate treatment apparatus

Abstract

A substrate treatment method in accordance with an exemplary embodiment includes: heating a substrate, for a substrate treatment process, so that a temperature of the substrate reaches a target temperature; calculating the temperature of the substrate using a sensor located facing the substrate while heating the substrate; and controlling an operation of a heating part configured to heat the substrate according to the temperature calculated from the calculating the temperature, wherein the calculating the temperature comprises: measuring a total radiant energy (Et) radiated from the substrate using the sensor; calculating a corrected total emissivity (εt0) by applying a correction value for correcting the total emissivity (εt) which is the emissivity of the radiant energy (Et); and calculating the temperature (Ts) of the substrate using the total radiant energy (Et) and the corrected total emissivity (εt0).

Claims13

Dependent claims

A substrate treatment method comprising:

heating a substrate, for a substrate treatment process, so that a temperature of the substrate reaches a target temperature;
calculating a temperature of the substrate using a sensor located facing the substrate while heating the substrate;
and
controlling an operation of a heating part configured to heat the substrate according to the temperature calculated from calculating the temperature, wherein calculating the temperature comprises:
measuring a total radiant energy (Er) radiated from the substrate using the sensor;
calculating a corrected total emissivity (εt0) by applying a correction value (ε0) for correcting a total emissivity (εt) which is the emissivity of the radiant energy (Et);
and
calculating the temperature (Ts) of the substrate using the total radiant energy (Er) and the corrected total emissivity (εt0).

5 more elements

A substrate treatment apparatus comprising:

a substrate support part configured to support a substrate on an upper portion thereof;
a base located to face the substrate support part under the substrate support part and provided with a reflective member installed on a surface thereof facing the substrate support part;
a heating part located over the substrate support part to face the substrate support part and configured to heat the substrate;
a sensor inserted and installed in the base to face the substrate mounted on the substrate support part, and configured to measure a total radiant energy (Et) and reflectivity (ps) which are radiated from the substrate;
and
a temperature control unit configured to calculate a temperature (Ts) of the substrate using the total radiant energy (Et) and reflectivity (ps), which are measured by the sensor and control an operation of the heating part according to the calculated temperature (Ts) of the substrate;
the temperature control unit calculates the temperature (Ts) of the substrate using a corrected total emissivity (εt0) calculated by applying a correction value (ε0) to a total emissivity (εt) which is the emissivity of the total radiant energy (Er).

4 more elements

Dependencies are inferred from the claim text.

Substrate treatment method and substrate treatment apparatus

Life of this patent

Substrate treatment method and substrate treatment apparatus

Life of this patent

Abstract

Claims13