Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate

A plating composition for electrolytic copper deposition, comprising copper ions, halide ions and at least one acid, characterized in that

• the plating composition further comprises:
• (a) at least one benzothiazole compound represented by the following formula (BT):
• wherein
• RBT1 is selected from the group consisting of substituted and unsubstituted alkyl group, substituted and unsubstituted aryl group and substituted and unsubstituted alkaryl group;
• RBT2 and RBT3 are independently substituted and unsubstituted alkyl groups;
• each of RBT4, RBT5, RBT6 and RBT7 are independently selected from the group consisting of hydrogen, substituted and unsubstituted alkyl group, substituted and unsubstituted oxyalkyl group and
• wherein RBT8 is selected from the group consisting of substituted and unsubstituted alkyl group, substituted and unsubstituted aryl group and substituted and unsubstituted alkaryl group;
• each of RBT9, RBT10, RBT11 and RBT12 are independently selected from the group consisting of hydrogen, substituted and unsubstituted alkyl group, substituted and unsubstituted oxyalkyl group and sulfonic acid group;
• (b) at least one phenazine dye;
• and
• (c) at least one ethanediamine derivative represented by the following formula (ED):
• wherein
• RED1, RED2, RED3 and RED4 are independently selected from the group consisting of substituted and unsubstituted oligo(oxyalkanediyl) group;
• and substituted and unsubstituted poly(oxyalkanediyl) group, and
• wherein the plating composition is free of intentionally added zinc ions.