Heat conformable curable adhesive films

An article comprising:

• a first substrate with a first major surface and a second major surface;
• and
• a curable film contacting the second major surface of the first substrate, the curable film comprising:
• a flexible, free-standing, optically clear, conformable film having a complex viscosity of greater than 100,000 poise (10,000 Pascal seconds) at 25° C., prior to setting;
• and
• wherein the set film has an adhesive shear strength of greater than 100 Newtons per square centimeter (N/cm2) to a glass substrate when measured according to the Shear Adhesion Test Method;
• and wherein the curable film comprises:
• an ethylenically unsaturated polyester-containing oligomeric composition that is the reaction product of a saturated, amorphous co-polyester polyol and a compound with a terminal polyol-reactive group and a terminal ethylenically unsaturated group;
• a (meth)acrylate functional material;
• and
• at least one initiator.

A method of using a curable film comprising:

• providing a curable film, the curable film comprising:
• a reactive composition comprising a flexible, free-standing, optically clear, conformable film having a complex viscosity of greater than 100,000 poise (10,000 Pascal seconds) at 25° C., prior to setting;
• and wherein the set film has an adhesive shear strength of greater than 100 Newtons per square centimeter (N/cm2) to a glass substrate when measured according to the Shear Adhesion Test Method;
• and wherein the reactive composition comprises:
• an ethylenically unsaturated polyester-containing oligomeric composition that is the reaction product of a saturated, amorphous co-polyester polyol and a compound with a terminal polyol-reactive group and a terminal ethylenically unsaturated group;
• a (meth)acrylate functional material;
• and
• at least one initiator
• providing a first substrate with a first major surface and a second major surface;
• contacting the curable film to the second major surface of the first substrate;
• heating the curable film on the second major surface of the first substrate to a temperature of less than 85° C. to permit conforming of the film to the first substrate;
• and
• curing the curable film.