Electronic component removal device
AssigneeRaytheon Company
InventorsBrad S. Williams, Yoram Baxter, Marco Ordonez, Bill Steadman
Life of this patent
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AssigneeRaytheon Company
InventorsBrad S. Williams, Yoram Baxter, Marco Ordonez, Bill Steadman
Estimating the term…
An electronic component removal device comprising a cutting wire routed through a cutting region configured to receive an electronic component coupled to a substrate. The electronic component removal device can also include a leading actuator coupled to a leading end of the cutting wire to cause movement of the cutting wire in a cutting direction at a cutting speed. The electronic component removal device can further include a trailing resistance device coupled to a trailing end of the cutting wire to resist movement of the cutting wire in the cutting direction with a variable resistance. In addition, the electronic component removal device can include a leading tension sensor to sense a leading tension in the cutting wire between the cutting region and the leading actuator. The trailing resistance device can resist movement of the cutting wire with a resistance that varies based on the leading tension in the cutting wire.
An electronic component removal device, comprising:
Dependencies are inferred from the claim text.