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US 10,964,677 B2Granted
Electronic packages with stacked sitffeners and methods of assembling same
AssigneeIntel Corporation
InventorsJenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim, Kooi Chi Ooi
Life of this patent
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Abstract
A semiconductor package apparatus includes a passive device that is embedded in a bottom package stiffener, and a top stiffener is stacked above the bottom package stiffener. Electrical connection through the passive device is accomplished through the stiffeners to a semiconductor die that is seated upon an infield region of the semiconductor package substrate.
Claims16
A semiconductor package apparatus, comprising:
- a semiconductor package substrate including a die side and land side;
- a metal package stiffener coupled to the die side by an electrically conductive adhesive;
- a plurality of capacitors, separate from the metal packager stiffener, and disposed in a plurality of recesses in the metal package stiffener, wherein each capacitor of the plurality of capacitors is electrically coupled to the metal package stiffener by a first contact;
- and
- a plate stiffener electrically coupled to the plurality of capacitors by a second contact, wherein the plate stiffener is stacked above the metal package stiffener.
2 more elements
A semiconductor package apparatus, comprising:
- a semiconductor package substrate including a die side and land side, and wherein the apparatus occupies a z-height;
- a metal package stiffener coupled to the die side by an electrically conductive adhesive;
- a plurality of capacitors, separate from the metal packager stiffener, and disposed in a plurality of recesses in the metal package stiffener, wherein each capacitor of the plurality of capacitors is electrically coupled to the metal package stiffener by a first contact, and wherein each of the plurality of capacitors occupies at least some of the same z-height;
- and
- a plate stiffener electrically coupled to the plurality of capacitors by a second contact, wherein the plate stiffener is stacked above the metal package stiffener.
2 more elements
Dependencies are inferred from the claim text.