Device and method for pressure-molding anti-overheating CSP fluorescent membrane

A method of a device for pressure-molding an anti-overheating CSP fluorescent membrane, the device including a lower pressing mould heating device (7), a force measuring device (14), a feeding device (16) and a mould pressing device (13), the mould pressing device (13) having an upper pressing mould, a lower pressing mould and a lower clamp (5), the upper pressing mould having an upper pressing mould body (1) and an upper pressing mould heating device (2), the lower pressing mould having a lower pressing mould body (6), the method comprising the steps of:

• step 1:
• starting the upper pressing mould heating device (2) and the lower pressing mould heating device (7) to preheat the upper pressing mould body (1) and the lower pressing mould body (6);
• step 2:
• clamping an LED chip into an upper surface of the lower clamp (5) and placing a fluorescent membrane above the LED chip at the same time;
• step 3:
• controlling, by the feeding device (16), only the upper pressing mould to move downward or only the lower pressing mould to move upward, so that the upper pressing mould and the lower pressing mould get close to each other, and measuring, by the force measuring device (14), a mould clamping force in real time;
• step 4:
• maintaining a mould clamping state, pressurizing the feeding device (16) until the mould clamping force measured in real time has a second inflection point, warming up the upper pressing mould body (1) and the lower pressing mould body (6) simultaneously through the heating devices, and maintaining the temperature and pressure;
• and
• step 5:
• controlling, by the feeding device (16), the upper pressing mould and the lower pressing mould to separate, and taking down the moulded LED chip to complete pressure molding.