Medium and method of manufacturing electronic component

A method of manufacturing an electronic component comprising:

• introducing only a plurality of multilayer bodies and media into a container, the plurality of multilayer bodies each including a first end surface and a second end surface opposed to each other in a direction of length, a first side surface and a second side surface opposed to each other in a direction of width perpendicular or substantially perpendicular to the direction of length, and a first main surface and a second main surface opposed to each other in a direction of height perpendicular or substantially perpendicular to the direction of length and the direction of width, the first end surface being provided with a first baked electrode layer, and the second end surface being provided with a second baked electrode layer;
• and
• applying vibration energy to the plurality of multilayer bodies and the media by applying vibration to the container, the container including a bottom portion and a circumferential wall portion connected to a circumferential edge of the bottom portion;
• wherein
• when an annular virtual axis circumferentially surrounding a central axis of the bottom portion is assumed in a state before vibration of the container, in the applying vibration energy to the plurality of multilayer bodies and the media, vibration is applied to the plurality of multilayer bodies and the media such that only the plurality of multilayer bodies and the media follow a helical trace helically surrounding the virtual axis along an axial direction of the virtual axis;
• and
• a frequency of the vibration applied to the container resonates with a natural frequency of the container.