Substrate pick-and-place equipment
AssigneesHkc Corporation Limited, Chongqing Hkc Optoelectronics Technology Co., Ltd.
InventorLi Song
Life of this patent
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AssigneesHkc Corporation Limited, Chongqing Hkc Optoelectronics Technology Co., Ltd.
InventorLi Song
Estimating the term…
This application relates to a substrate pick-and-place equipment and method. The equipment includes: a bearer platform, configured to bear a substrate; a retractable apparatus, including: a foldable bracket, disposed above the bearer platform and foldable along a horizontal direction; a plurality of suction structures, disposed on a bottom of the foldable bracket, where the suction structures are evenly distributed in a coverage area of the foldable bracket, and are configured to suck the substrate; a first drive unit, configured to drive the foldable bracket to extend and retract along the horizontal direction; and a second drive unit, configured to drive the retractable apparatus to rise and descend along a vertical direction; and a conveying apparatus, operating between the bearer platform and the foldable bracket. In the substrate pick-and-place method, a substrate is picked and placed from an upward side by using a suction structure.
A substrate pick-and-place equipment, comprising:
A substrate pick-and-place equipment, comprising:
Dependencies are inferred from the claim text.