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US 10,952,352 B2Granted
Assemblies including heat dispersing elements and related systems and methods
AssigneeMicron Technology, Inc.
InventorXiaopeng Qu
Life of this patent
Estimating the term…
Abstract
Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprises at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy includes transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.
Claims28
An assembly, comprising:
- a base substrate;
- substrates in electronic communication with the base substrate, a proximal end of each of the substrates being connected to the base substrate;
- at least one electronic device coupled to at least one substrate of the substrates;
- and
- heat dissipation elements comprising:
- at least one heat spreader in physical communication with the at least one electronic device, the heat spreader extending on a lateral side of the at least one substrate from the proximal end of the at least one substrate at least to a distal end of the at least one substrate;
- and
- at least one heat sink positioned at the distal end of the substrates at a location opposite the base substrate, the at least one heat sink being in thermal communication with the at least one heat spreader, and the at least one heat sink including a plurality of laterally separated, vertically protruding, and longitudinally extending fins defining a plurality of unobstructed longitudinal channels;
- and
- a chassis extending from the base substrate, around the substrates and the heat dissipation elements, and back to the base substrate, wherein the chassis includes openings at opposing ends to enable fluid flow through the chassis, wherein a first side of the chassis is coupled to the base substrate on a first side of the assembly and a second side of the chassis is coupled to the base substrate on a second side of the assembly, and wherein a portion of the chassis is positioned adjacent the at least one heat sink.
7 more elements
An assembly, comprising:
- a base substrate;
- circuit boards coupled to the base substrate at a first end of the circuit boards, each circuit board having at least one heat-generating component coupled thereto;
- heat dissipation elements comprising:
- heat spreaders, each being in physical communication with the at least one heat-generating component of one of the circuit boards on a lateral side of the circuit boards;
- and
- at least another heat dissipation element positioned at a location proximate a second end of the circuit boards opposing the first end, the at least another heat dissipation element being in physical communication with the heat spreaders at the location proximate the second end of the circuit boards, and the at least another heat dissipation element including a plurality of laterally separated, vertically protruding, and longitudinally extending fins defining a plurality of unobstructed longitudinal channels;
- and
- a chassis extending from the base substrate, around the circuit boards and the heat dissipation elements, and back to the base substrate, wherein the chassis includes openings at opposing ends to enable fluid flow through the chassis, wherein a portion of the chassis is positioned adjacent the at least another heat dissipation element, and wherein a resilient element is positioned between the chassis and the at least another heat dissipation element.
5 more elements
A system, comprising:
- at least one electronic signal processor;
- and
- a memory assembly configured to communicate electrically with the at least one electronic signal processor, the memory assembly comprising:
- a base substrate comprising connectors;
- circuit boards, each being coupled to one connector and having memory devices coupled on opposing sides of a respective circuit board;
- heat dissipation elements comprising:
- heat spreaders positioned on opposing sides of the circuit boards;
- and
- a heat sink in thermal communication with each of the heat spreaders and at least one of the circuit boards, the heat sink positioned at a location distal to the connectors of the base substrate, and the heat sink including a plurality of laterally separated, vertically protruding, and longitudinally extending fins defining a plurality of unobstructed longitudinal channels;
- and
- a chassis extending from the base substrate, around the circuit boards and the heat dissipation elements, and back to the base substrate, wherein the chassis includes openings at opposing ends to enable fluid flow through the chassis, wherein a first side of the chassis is coupled to the base substrate on a first side of the memory assembly and a second side of the chassis is coupled to the base substrate on a second side of the memory assembly, and wherein a portion of the chassis is positioned adjacent the heat sink.
8 more elements
A method of dissipating heat energy from an assembly, the method comprising:
- transferring heat energy from memory devices coupled to circuit boards to heat spreaders positioned adjacent to the memory devices, the circuit boards being electronically coupled to a base substrate at a first location;
- transferring the heat energy from the heat spreaders to a heat sink positioned at a second location of the circuit boards away from the first location, the heat sink being in thermal communication via an abutting interface with the memory devices of the circuit boards, the heat sink including a plurality of laterally separated, vertically protruding, and longitudinally extending fins defining a plurality of unobstructed longitudinal channels;
- directing fluid flow through openings at opposing ends of a chassis and through a channel defined by the chassis, the chassis extending from the base substrate, around the circuit boards, around and adjacent the heat sink, and back to the base substrate, a first side of the chassis coupled to the base substrate on a first side of the assembly and a second side of the chassis coupled to the base substrate on a second side of the assembly;
- and
- transferring the heat energy to the fluid flow.
2 more elements
Dependencies are inferred from the claim text.