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US 10,952,331 B2Granted
Wire soldered structure
AssigneeAltek Biotechnology Corporation
InventorsFang-Mentg Kuo, Te-Yu Chung, Chao-Yu Chou
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Abstract
A wire soldered structure includes a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer; a wire including a soldered portion that is disposed on the first conducting layer and that is adjacent to the through hole; and a solder disposed in the through hole; wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder.
Claims17
A wire soldered structure, comprising:
- a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer;
- a wire including:
- an inner conductor;
- an insulating layer covering the inner conductor;
- and
- a soldered portion covering the insulating layer and disposed on the first conducting layer and that is adjacent to the through hole;
- and
- a solder disposed in the through hole;
- wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder to bond the wire on the substrate.
6 more elements
A wire soldered structure, comprising:
- a substrate including a main body, a first conducting layer disposed on the main body, a second conducting layer disposed on the main body and opposite to the first conducting layer, a through hole extending through the main body and the first conducting layer, and a third conducting layer that is disposed on an inner surface of the through hole and that is connected between the first conducting layer and the second conducting layer;
- a wire including:
- an inner conductor;
- an insulating layer covering the inner conductor;
- and
- a soldered portion covering the insulating layer and disposed on the first conducting layer and that is adjacent to the through hole;
- and
- a preset solder disposed on at least one of the soldered portion of the wire and the first conducting layer of the substrate;
- wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the preset solder to bond the wire on the substrate.
6 more elements
Dependencies are inferred from the claim text.