Repairing defective through-holes
AssigneeInternational Business Machines Corporation
InventorsPrabjit Singh, Daniel J. Kearney
Life of this patent
Estimating the term…
Loading patent…
AssigneeInternational Business Machines Corporation
InventorsPrabjit Singh, Daniel J. Kearney
Estimating the term…
A method for repairing a through-hole includes inserting a repair coil, comprising a tightly-wound repair strip, into a through-hole and inserting a heating element into the repair coil. Passing an electrical current through the heating element liquefies a bonding material disposed on the repair coil and the repair coil expands within the through-hole. Subsequently solidifying the bonding material bonds the repair coil to the through-hole. A repair assembly comprises a repair coil inserted into a through-hole and a heating element inserted into the repair coil. The repair coil comprises a tightly-wound repair strip. The heating element comprises a segment of a heating wire enclosed within an insulating material. Passing an electric current through the segment of the heating wire liquefies bonding material disposed on the repair coil and the repair coil expands within the through-hole. The liquified bonding material solidifies to bond the repair coil to the through-hole.
A method for repairing a defective through-hole, the method comprising:
Dependencies are inferred from the claim text.