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US 10,952,329 B2Granted
Copper clad laminates and method for manufacturing a printed circuit board using the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoun-Gyu Han, Sang-jae Lee
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Abstract
A copper clad laminate and a method to manufacture the same are provided. In one general aspect, a copper clad laminate include a first copper clad layer on a first surface of an insulating layer, and a second copper clad layer on a second surface of the insulating layer. The second copper clad layer includes polymer resin layer, a second copper layer, and a carrier foil layer.
Claims3
A copper clad laminate, comprising:
- a first copper clad layer made of copper directly disposed on a first outer surface of an insulating layer comprising a reinforcing material, a filler and a resin;
- and
- a second copper clad layer directly disposed on a second outer surface of the insulating layer opposite the first outer surface of the insulating layer,
- wherein the second copper clad layer comprises a polymer resin layer directly disposed on the second outer surface of the insulating layer, a second copper layer made of copper directly disposed on the polymer resin layer, and a carrier foil layer directly disposed on the second copper layer,
- wherein the first copper clad layer is an exposed exterior of the copper clad laminate,
- wherein the polymer resin layer consists of at least one selected from the group consisting of a polyamide-imide, a liquid crystal polymer, a cyclic olefin polymer and a mixture thereof, and
- wherein the carrier foil layer comprises a benzotriazole-based organic remover or a metallic remover as a remover coating.
4 more elements
Dependencies are inferred from the claim text.