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US 10,952,327 B2Granted
Semiconductor module
AssigneeSamsung Electronics Co., Ltd.
InventorsJae-Seok Jang, Dongmin Jang, Geunje Park, Jaekwang Lee
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Abstract
A semiconductor module includes a module substrate having a first side extending in a first direction, a plurality of upper packages disposed on a top surface of the module substrate and arranged in rows extending in the first direction, and a passive element disposed on the top surface of the module substrate. At least a portion of the passive element overlaps one of the upper packages when viewed in a plan view, and the upper packages of a first row are arranged to be shifted with respect to the upper packages of a second row in the first direction.
Claims18
A semiconductor module, comprising:
- a module substrate having a first side extending in a first direction, and a second side opposite to the first side;
- a plurality of upper packages disposed on a top surface of the module substrate, and arranged in a plurality of rows extending in the first direction,
- wherein the upper packages of a first row belonging to the plurality of rows are arranged to be shifted with respect to the upper packages of a second row belonging to the plurality of rows in the first direction,
- wherein the module substrate comprises a first region disposed between the first side of the module substrate and the upper packages of the second row, a second region disposed between the upper packages of the first row and the upper packages of the second row, and a third region disposed between another side of the module substrate and an outermost upper package of the first row and between the another side and an outermost upper package of the second row;
- a first passive element comprising a first portion and a second portion,
- wherein the first portion of the first passive element is disposed between a bottom surface of one of the upper packages of the second row and the top surface of the module substrate, and the second portion of the first passive element is disposed in the first region and is not disposed between the bottom surface of the one of the upper packages of the second row and the top surface of the module substrate;
- a second passive element comprising a first portion and a second portion,
- wherein the first portion of the second passive element is disposed between a bottom surface of one of the upper packages of the first row and the top surface of the module substrate, and the second portion of the second passive element is disposed in the second region and is not disposed between the bottom surface of the one of the upper packages of the first row and the top surface of the module substrate;
- and
- a third passive element comprising a first portion and a second portion,
- wherein the first portion of the third passive element is disposed between a bottom surface of the outermost upper package of the first row and the top surface of the module substrate, and the second portion of the third passive element is disposed in the third region and is not disposed between the bottom surface of the outermost upper package of the first row and the top surface of the module substrate.
8 more elements
A semiconductor module, comprising:
- a module substrate having a first side, a second side opposite to the first side, a third side adjacent to the first side, a fourth side opposite to the third side, and a first region;
- a plurality of tabs disposed on a top surface of the module substrate adjacent to the first side;
- a plurality of memory packages mounted on the top surface of the module substrate and arranged in a plurality of rows extending in a first direction;
- and
- a passive element comprising a first portion and a second portion, and mounted on the top surface of the module substrate,
- wherein the first side of the module substrate extends in the first direction,
- wherein the memory packages comprise:
- a plurality of first packages disposed in a first row belonging to the plurality of rows in a plan view;
- and
- a plurality of second packages disposed in a second row belonging to the plurality of rows in the plan view, wherein the second packages are closer to the tabs than the first packages,
- wherein the first region is disposed between the tabs and the second packages, when viewed in the plan view, and
- wherein the first portion of the passive element is disposed between a bottom surface of one of the second packages and the top surface of the module substrate, and the second portion of the passive element is disposed in the first region and is not disposed between the bottom surface of the one of the second packages and the top surface of the module substrate.
9 more elements
A semiconductor module, comprising:
- a module substrate having a first side extending in a first direction and a second side extending in the first direction;
- a plurality of tabs disposed on a top surface of the module substrate adjacent to the first side;
- a plurality of memory packages mounted on the top surface of the module substrate and arranged in a plurality of rows extending in the first direction;
- and
- a passive element comprising a first portion and a second portion, and mounted on the top surface of the module substrate,
- wherein the memory packages comprise:
- a plurality of first packages disposed in a first row belonging to the plurality of rows in a plan view;
- and
- a plurality of second packages disposed in a second row belonging to the plurality of rows in the plan view,
- wherein the second packages are closer to the tabs than the first packages, each of the first packages has a long axis parallel to a second direction that is substantially perpendicular to the first direction, and each of the second packages has a long axis parallel to the first direction,
- wherein a region of the module substrate is disposed between the first packages and the second packages, when viewed in the plan view, and
- wherein the first portion of the passive element is disposed between a bottom surface of one of the first packages and the top surface of the module substrate, and the second portion of the passive element is disposed in the region and is not disposed between the bottom surface of the one of the first packages and the top surface of the module substrate.
9 more elements
Dependencies are inferred from the claim text.