Printed wiring board and method for manufacturing same

A printed wiring board, comprising:

• a core layer comprising a conductor circuit located on a surface of an insulator;
• a first buildup layer containing a first resin which is laminated on a surface of the core layer;
• a second buildup layer containing a second resin which is laminated on a surface of the first buildup layer;
• a first conductor layer laminated on the surface of the first buildup layer between the first and second buildup layers;
• and a through hole extending through the core layer, the first buildup layer, and the second buildup layer, and a second conductor layer extending continuously on an exposed bottom surface of the second buildup layer, on an inner surface of the through hole and on a top surface of the printed wiring board opposite the exposed bottom surface of the second buildup layer, wherein the first resin and the second resin are different from each other, the second buildup layer comprises a plurality of vias which are filled with a conductor and located on an identical circumference equally spaced around an opening of the through hole, and wherein the plurality of vias, which are filled with the conductor, are electrically independent, are directly connected to the first conductor layer, and the filled vias are not electrically connected to the second conductor layer.