Electronic component embedded substrate
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung Kwan Lee, Kyoung Jun Kim, Yong Hoon Kim, Seung Eun Lee, Hak Chun Kim
Life of this patent
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Abstract
An electronic component embedded substrate includes a core layer having a first cavity and a second cavity on a first surface and a second surface of the core layer, respectively, the second surface opposite to the first surface in a thickness direction of the core layer; an electronic component disposed in the first cavity; a first insulating material covering at least a portion of the electronic component; a first wiring layer disposed on the first insulating material and connected to the electronic component; a built-in block disposed in the second cavity; and a second insulating material covering at least a portion of the built-in block.
Claims20
An electronic component embedded substrate comprising:
- a core layer having a first cavity and a second cavity on a first surface and a second surface of the core layer, respectively, the second surface opposite to the first surface in a thickness direction of the core layer;
- an electronic component disposed in the first cavity;
- a first insulating material covering at least a portion of the electronic component;
- a first wiring layer disposed on the first insulating material and connected to the electronic component;
- a built-in block disposed in the second cavity;
- and
- a second insulating material covering at least a portion of the built-in block,
- wherein the second insulating material covers at least a portion of an exposed surface of the built-in block in the thickness direction, and is disposed in a gap between the second cavity an the built-in block in a direction perpendicular to the thickness direction.
An electronic component embedded substrate comprising:
- a core layer having a first cavity and a second cavity on a first surface and a second surface of the core layer, respectively, the second surface opposite to the first surface in a thickness direction of the core layer;
- an electronic component disposed in the first cavity;
- a first insulating material covering at least a portion of the electronic component;
- a first wiring layer disposed on the first insulating material and connected to the electronic component;
- a built-in block, which is in a form of a lump, disposed in the second cavity;
- a second insulating material covering at least a portion of the built-in block;
- a second wiring layer disposed on the second insulating material;
- and
- a through-via penetrating through the core layer and the built-in block and connecting the first wiring layer and the second wiring layer to each other.
An electronic component embedded substrate comprising:
- a first build-up structure including a first wiring layer;
- one or more electronic components disposed in the first build-up structure and connected to the first wiring layer;
- a second build-up structure including a second wiring layer and disposed on the first build-up structure;
- one or more built-in blocks, each of which is in a form of a lump, disposed in the second build-up structure;
- an insulating layer arranged between the one or more electronic components of the first build-up structure and the one or more built-in blocks of the second build-up structure;
- and
- a through-via penetrating through the insulating layer and the built-in block and connecting the first wiring layer and second wiring layer to each other.
Dependencies are inferred from the claim text.