Method for manufacturing electronic device

A method for manufacturing an electronic device, comprising the following steps:

• providing a substrate;
• forming a metal layer on the substrate, wherein the metal layer has a first surface;
• forming a first insulating layer on the first surface of the metal layer;
• forming a second insulating layer on the first insulating layer;
• etching the first insulating layer and the second insulating layer to form a contact hole, wherein the contact hole exposes a portion of the first surface;
• cleaning the portion of the first surface exposed by the contact hole with a solution, wherein a recess is formed at a boundary between the metal layer and the first insulating layer;
• and
• forming a transparent conductive layer on the second insulating layer, wherein the transparent conductive layer electrically connects with the metal layer;
• wherein the recess connects with the contact hole.