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US 10,952,316 B2Granted
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Hong Min, Ju Ho Kim
Life of this patent
Estimating the term…
Abstract
A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulation layer which is bendable, and the second substrate portion includes a frame member inserted into the flexible insulation layer.
Claims16
A printed circuit board, comprising:
- a first substrate portion;
- and
- a second substrate portion connected to the first substrate portion, and having a flexible insulation layer which is bendable and comprises a first insulation layer having a through-hole therein and a second insulation layer,
- wherein the second substrate portion includes a frame member disposed in the through-hole, and
- the second insulation layer fills at least a portion of a gap between the frame member and the first insulation layer.
2 more elements
A printed circuit board, comprising:
- a first substrate portion;
- and
- a second substrate portion comprising a bendable flexible insulation layer embedding a frame member and connected to the first substrate portion,
- wherein the frame member is distinguishable from circuit patterns of the printed circuit board, and
- wherein the flexible insulation layer comprises a first insulation material surrounding the frame member and a second insulation material embedding the first insulation material and the frame member.
2 more elements
A printed circuit board, comprising:
- a first substrate portion;
- and
- a second substrate portion connected to the first substrate portion, and having a flexible insulation layer which is bendable,
- wherein the second substrate portion includes a frame member embedded within the flexible insulation layer,
- wherein the frame member includes a recess configured to accommodate an electronic component disposed therein, the electronic component being embedded in flexible insulation layer,
- wherein the flexible insulation layer comprises a first insulation material surrounding the frame member and a second insulation material embedding the first insulation material and the frame member.
3 more elements
Dependencies are inferred from the claim text.