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US 10,952,312 B2Granted
Communication module packaging
AssigneeII-Vi Delaware, Inc.
InventorsJianwei Mu, Hongyu Deng
Life of this patent
Estimating the term…
Abstract
A communication module may include a communication ground layer. The communication module may also include a circuit board. The circuit board may be located proximate the communication ground layer. The circuit board may include a stitch layer. The stitch layer may be electrically coupled to the communication ground layer via a plurality of stitch layer vias. Additionally, the communication module may include multiple ground vias. The ground vias may be electrically coupled to a portion of the circuit board and to the communication ground layer.
Claims20
A communication module comprising:
- a communication ground layer;
- a circuit board located proximate the communication ground layer, the circuit board including:
- a stitch layer electrically coupled to the communication ground layer via a plurality of stitch layer vias;
- and
- two circuit board signal traces that are spaced apart from and extend along opposite sides of the stitch layer along an entire length of the stitch layer;
- a plurality of ground vias electrically coupled to a portion of the circuit board and to the communication ground layer;
- an enclosure within which at least some components of the communication module are positioned;
- and
- one or more enclosure vias that electrically couple the stitch layer to the enclosure.
6 more elements
A communication module comprising:
- a communication ground layer;
- a circuit board located proximate the communication ground layer, the circuit board including:
- a stitch layer electrically coupled to the communication ground layer via a plurality of stitch layer vias;
- and
- two circuit board signal traces that are spaced apart from and extend along opposite sides of the stitch layer along an entire length of the stitch layer;
- an IC ground that includes a first portion electrically coupled to the communication ground layer via a plurality of IC ground vias, the IC ground further including an extended IC ground portion that extends continuously from and coplanar with the first portion beyond a first edge of the circuit board, wherein the extended IC ground portion is electrically coupled to a portion of the circuit board and the communication ground layer via a plurality of extended IC ground vias;
- and
- a plurality of ground vias electrically coupled to a portion of the circuit board and to the communication ground layer.
5 more elements
A communication module comprising:
- a communication ground layer;
- a plurality of signal wire bonds, a plurality of ground wire bonds, and a plurality of ground vias;
- an IC located proximate the communication ground layer and electrically coupled to a circuit board via the plurality of signal wire bonds and the plurality of ground wire bonds;
- the circuit board located proximate the communication ground layer and the IC, the circuit board including:
- a plurality of circuit board signal traces, wherein each circuit board signal trace of the plurality of circuit board signal traces is electrically coupled to the IC via a corresponding signal wire bond of the plurality of signal wire bonds;
- a plurality of circuit board ground traces electrically coupled to the communication ground layer via the plurality of ground vias, wherein each circuit board ground trace of the plurality of circuit board ground traces is electrically coupled to the IC via a corresponding ground wire bond of the plurality of ground wire bonds and wherein each circuit board ground trace is spaced apart from and extends lengthwise along an entire length of a corresponding one of the plurality of circuit board signal traces;
- and
- a stitch layer electrically coupled to the communication ground layer via a plurality of stitch layer vias, wherein the plurality of circuit board signal traces includes two circuit board signal traces that are spaced apart from and extend along opposite sides of the stitch layer along an entire length of the stitch layer and beyond terminal ends of the stitch layer;
- and
- an IC ground located proximate the IC, the IC ground electrically coupled to the IC, the IC ground including a first portion electrically coupled to the communication ground layer via a plurality of IC ground vias, the IC ground further including an extended IC ground portion that extends continuously from and coplanar with the first portion beyond a first edge of the circuit board, wherein the extended IC ground portion is electrically coupled to the circuit board ground traces and the communication ground layer via a plurality of extended IC ground vias.
7 more elements
Dependencies are inferred from the claim text.