High-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorSyuichi Onodera
Life of this patent
Estimating the term…
Abstract
A high-frequency module (1) includes a substrate (10), a first electronic component (13) and a second electronic component (14) that are provided on the substrate (10), an insulating layer (15) that covers a part of a side surface of the first electronic component (13) and a side surface and a top surface of the second electronic component (14), and a heat-dissipating layer (16) that covers at least a top surface of the first electronic component (13) and a portion of the side surface of the first electronic component (13) excluding the portion of the side surface of the first electronic component (13) in contact with the insulating layer (15).
Claims16
A high-frequency module comprising:
- a substrate;
- a first electronic component and a second electronic component each provided on the substrate;
- an insulating layer covering a one part of a side surface of the first electronic component, and a side surface and a top surface of the second electronic component;
- a heat-dissipating layer covering at least a top surface of the first electronic component and a remaining part of the side surface of the first electronic component excluding the one part of the side surface of the first electronic component;
- and
- a flat layer provided on the heat-dissipating layer making a top surface of the high-frequency module flat,
- wherein a thermal conductivity of the flat layer is greater than or equal to a thermal conductivity of the insulating layer,
- wherein heat-generating ability of the first electronic component is higher than a heat-generating ability of the second electronic component, and
- wherein the first electronic component is a power amplifier or a duplexer.
A high-frequency module comprising:
- a substrate;
- a first electronic component and a second electronic component each provided on the substrate;
- an insulating layer covering a one part of a side surface of the first electronic component, and a side surface and a top surface of the second electronic component;
- and
- a heat-dissipating layer covering at least a top surface of the first electronic component and a remaining part of the side surface of the first electronic component excluding the one part of the side surface of the first electronic component,
- wherein a top surface of the heat-dissipating layer is flat and extends over the first electronic component and the second electronic component.
A high-frequency module comprising:
- a substrate;
- a first electronic component and a second electronic component each provided on the substrate;
- an insulating layer covering a one part of a side surface of the first electronic component, and a side surface and a top surface of the second electronic component;
- a heat-dissipating layer covering at least a top surface of the first electronic component and a remaining part of the side surface of the first electronic component excluding the one part of the side surface of the first electronic component;
- and
- a flat layer provided on the heat-dissipating layer making a top surface of the high-frequency module flat,
- wherein a thermal conductivity of the flat layer is greater than or equal to a thermal conductivity of the insulating layer,
- wherein the top surface of the first electronic component is located at a greater distance than the top surface of the second electronic component from a surface of the substrate, and
- wherein the first electronic component is a power amplifier or a duplexer.
Dependencies are inferred from the claim text.