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US 10,952,283 B2Granted
Structural design and process to improve the temperature modulation and power consumption of an IR emitter
AssigneeKoninklijke Philips N.V.
InventorsZhi-Xing Jiang, Raymond Davis
Life of this patent
Estimating the term…
Abstract
An infrared emitter is formed having a reduced thermal mass and increased thermal conductivity to effectively deliver and dissipate heat from a heating element that emits electromagnetic radiation. The improved thermal dynamic process may enhance one or both of power consumption and/or longevity.
Claims14
An infrared emitter, the emitter comprising:
- a substrate having a first surface and a second surface opposite the first surface, the substrate being substantially planar, the substrate having a thermal conductivity of less than 5 W/m ° C.;
- a heating element disposed on a portion of the first surface of the substrate, the heating element being configured to emit infrared electromagnetic radiation in response to an electrical current being introduced thereto;
- a heat-dispersive layer disposed on the first surface of the substrate, the heat-dispersive layer of thickness less than 40 covering at least 70% of the first surface, and being formed from a material having a thermal conductivity of at least 110 W/m ° C., the heat-dispersive layer being interposed between at least a portion of the heating element and the first surface of the substrate;
- and
- a backing layer disposed on the second surface of the substrate, the backing layer being formed from a material having a thermal conductivity of at least 145 W/m ° C.
2 more elements
An infrared emitter, comprising:
- a substrate that is substantially planar and has a thermal conductivity of less than 5 W/m ° C.;
- a heat-dispersive layer disposed on a first surface of the substrate and covering at least 70% of the first surface of the substrate, the heat-dispersive layer having a thermal conductivity of at least 110 W/m ° C.;
- and
- a heating element configured to emit infrared electromagnetic radiation responsive to electrical current flow through the heating element, wherein the heating element comprises a layer disposed on the first surface of the substrate with the heat-dispersive layer interposed between at least a portion of the heating element and the first surface of the substrate.
1 more element
Dependencies are inferred from the claim text.