Light source for integrated silicon photonics

A testing layout of a plurality of light sources on a silicon wafer comprising:

• a silicon handle wafer being patterned with a matrix of dies separated by a grid of boundary regions, each die having at least one chip site configured with a surface region, a trench region, and a first stopper region located separately between the surface region and the trench region, the first stopper region being substantially leveled with the surface region, the trench region being configured to be a depth lower than the surface region;
• a plurality of laser diode chips flip-bonded to the matrix of dies, each laser diode chip having a p-side facing a respective one chip site in a respective die and a n-side being distal to the chip site, the p-side comprising a gain region bonded to the trench region, an electrode region bonded to the surface region, and an isolation region engaged with the stopper region to isolate the gain region from the electrode region;
• a conductor layer in the respective one die configured to connect the gain region electrically to an anode electrode and separately connect the electrode region electrically to a cathode electrode;
• and
• an interconnect line formed from the conductor layer extended in a respective one of the grid of boundary regions and configured to connect a cathode electrode of a first die to an anode electrode of a second die that is neighboring to the first die along either a row or a column of the matrix of dies.