Method for manufacturing organic electronic device

A manufacturing method of an organic electronic device, comprising:

• a removing step of removing a volatile component from a flexible base material;
• a fixing step of fixing the flexible base material onto a support substrate via an adhesive layer;
• and
• a forming step of forming a device main body portion sequentially including a first electrode layer, at least one organic functional layer, and a second electrode layer on the flexible base material that is fixed onto the support substrate, on a side opposite to the support substrate, in this order,
• wherein a vapor pressure of the volatile component is greater than or equal to 101325 Pa within a temperature range from 20° C. to a melting point of a parent resin of the flexible base material, and
• wherein the forming step includes a step of performing heating at a temperature of higher than or equal to a glass transition point of the flexible base material.