Method of encapsulating an environmentally sensitive device

A method of encapsulating environmentally sensitive devices, the method comprising:

• providing a flexible substrate;
• temporarily laminating the flexible substrate adjacent to a rigid support with a reversible adhesive;
• masking regions on the flexible substrate to define areas corresponding to first barrier stacks;
• applying the first barrier stacks adjacent to the flexible substrate after the flexible substrate is laminated adjacent to the rigid support, each of the first barrier stacks comprising at least one barrier layer and at least one decoupling layer;
• applying the environmentally sensitive devices over the flexible substrate such that the environmentally sensitive devices are formed adjacent to the first barrier stacks;
• applying second barrier stacks adjacent to the environmentally sensitive devices, each of the second barrier stacks comprising at least one barrier layer and at least one decoupling layer such that an edge seal is formed by each of the second barrier stacks about each of the edges of the environmentally sensitive devices, each of the environmentally sensitive devices being encapsulated between a corresponding first barrier stack and a corresponding second barrier stack;
• removing the flexible substrate from the rigid support by decoupling the adhesive;
• and
• cutting the flexible substrate between the defined areas after such removing.