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US 10,950,759 B2Granted
LED module
AssigneeRohm Co., Ltd.
InventorMasahiko Kobayakawa
Life of this patent
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Abstract
An LED module 101 is provided with an LED chip 200 that includes a sub-mount substrate 210 made of Si and a semiconductor layer 220 laminated on the sub-mount substrate 210. The module also includes white resin 280 that does not transmit light from the semiconductor layer 220 and that covers at least part of a side of the sub-mount substrate 210, where the side is connected to the surface on which the semiconductor layer 220 is laminated. These arrangements enhance the brightness of the LED module 101.
Claims20
An LED module comprising:
- a first electrical conductor including a first surface and a second surface that face opposite to each other;
- a light emitter mounted on the first electrical conductor and including a substrate and a light-emitting layer;
- a first resin disposed on the first electrical conductor so as to surround the light emitter as viewed in a first direction perpendicular to the first surface;
- and
- a second resin covering the light emitter and the first resin,
- wherein the first electrical conductor includes a main body and protrusion that is smaller in thickness than the main body,
- the protrusion includes a curved surface,
- the light emitter is disposed at a position overlapping with the curved surface as viewed in the first direction, and
- the first resin includes a curved upper surface with which the second resin is held in contact.
6 more elements
An LED module comprising:
- a first electrical conductor including a first surface and a second surface that face opposite to each other;
- a light emitter mounted on the first electrical conductor and including a substrate and a light-emitting layer;
- a first resin disposed on the first electrical conductor so as to surround the light emitter as viewed in a first direction perpendicular to the first surface;
- and
- a second resin covering the light emitter and the first resin,
- wherein the first electrical conductor includes a main body and protrusion that is smaller in thickness than the main body,
- the protrusion includes a curved surface,
- the light emitter is disposed at a position overlapping with the curved surface as viewed in the first direction,
- the second resin includes a first portion and a second portion different from the first portion, the first portion overlapping with the light emitter as viewed in the first direction and being smaller in thickness than the second portion, and
- the second portion overlaps with the main body as viewed in the first direction.
7 more elements
Dependencies are inferred from the claim text.