Chip package and method for forming the same
AssigneeXintec Inc.
InventorsShu-Ming Chang, Tsang-Yu Liu
Life of this patent
Estimating the term…
Abstract
A chip package is provided. the chip package includes a substrate having an upper surface, a lower surface, and a sidewall surface that is at an edge of the substrate. The substrate includes a sensing device adjacent to the upper surface of the substrate to sense a light source. The chip package also includes a first color filter layer disposed on the upper surface of the substrate to shield the light source. The first color filter layer includes an opening, so that the first color filter layer surrounds the sensing device via the opening. In addition, the chip package includes a redistribution layer disposed on the lower surface of the substrate. A method of forming the chip package is also provided.
Claims17
A chip package, comprising:
- a substrate having an upper surface, a lower surface, and a sidewall surface that is at an edge of the substrate, wherein the substrate comprises a sensing device adjacent to the upper surface of the substrate to sense a light source;
- a first color filter layer disposed on the upper surface of the substrate to shield the light source, wherein the first color filter layer comprises an opening, so that the first color filter layer surrounds the sensing device via the opening;
- a redistribution layer disposed on the lower surface of the substrate;
- and
- a second color filter layer covering the redistribution layer, wherein the second color filter layer comprises a plurality of openings to expose the redistribution layer.
A chip package, comprising:
- a substrate having an upper surface, a lower surface, and a sidewall surface that is at an edge of the substrate, wherein the substrate comprises a sensing device adjacent to the upper surface of the substrate to sense a light source;
- a first color filter layer disposed on the upper surface of the substrate to shield the light source, wherein the first color filter layer comprises an opening, so that the first color filter layer surrounds the sensing device via the opening;
- a redistribution layer disposed on the lower surface of the substrate;
- and
- a protective layer covering the first color filter layer and including an opening corresponding to the opening of the first color filter layer, so that the protective layer surrounds the sensing device via the opening of the protective layer.
A chip package, comprising:
- a substrate having an upper surface, a lower surface, and a sidewall surface that is at an edge of the substrate, wherein the substrate comprises a sensing device adjacent to the upper surface of the substrate to sense a light source;
- a first color filter layer disposed on the upper surface of the substrate to shield the light source, wherein the first color filter layer comprises an opening, so that the first color filter layer surrounds the sensing device via the opening;
- a redistribution layer disposed on the lower surface of the substrate;
- a cover plate disposed between the upper surface of the substrate and the first color filter layer;
- and
- an adhesive layer disposed between the upper surface of the substrate and the cover plate, wherein the adhesive layer and the cover plate cover the sensing device.
Dependencies are inferred from the claim text.