Semiconductor device
AssigneeToshiba Memory Corporation
InventorsJunji Kataoka, Tomomasa Ueda, Tomoaki Sawabe, Keiji Ikeda, Nobuyoshi Saito
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AssigneeToshiba Memory Corporation
InventorsJunji Kataoka, Tomomasa Ueda, Tomoaki Sawabe, Keiji Ikeda, Nobuyoshi Saito
Estimating the term…
According to one embodiment, a semiconductor device includes a semiconductor layer and a first layer. The semiconductor layer includes a first portion including a first element and oxygen. The first element includes at least one selected from the group consisting of In, Ga, Zn, Al, Sn, Ti, Si, Ge, Cu, As, and W. The first layer includes a second element including at least one selected from the group consisting of W, Ti, Ta, Mo, Cu, Al, Ag, Hf, Au, Pt, Pd, Ru, Y, V, Cr, Ni, Nb, In, Ga, Zn, and Sn. The first portion includes a first region and a second region. The second region is provided between the first region and the first layer. The first region includes a bond of the first element and oxygen. The second region includes a bond of the first element and a metallic element.
A semiconductor device, comprising:
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.