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US 10,950,688 B2Granted
Packages for power modules with integrated passives
AssigneeKemet Electronics Corporation
InventorsJohn Bultitude, Lonnie G. Jones, Allen Templeton, Philip M. Lessner
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Abstract
Provided herein is a module for packaging semiconductors comprising: at least one PDC comprising parallel internal electrodes of alternating polarity with a paraelectric dielectric between adjacent internal electrodes wherein the paraelectric dielectric has a permittivity above 10 to no more than 300; and wherein the PDC forms a capacitor couple with at least one semiconductor.
Claims33
A module for packaging semiconductors comprising:
- at least one PDC comprising parallel internal electrodes of alternating polarity with a paraelectric dielectric between adjacent internal electrodes wherein said paraelectric dielectric has a permittivity above 10 to no more than 300;
- wherein said PDC forms a capacitor couple with at least one semiconductor device;
- and
- wherein said PDC has a voltage rating of 500V to 10,000V with a capacitance per unit volume of at least 1.0 μF/cc rated at 500V and a capacitance per unit volume of at least 0.003 μF/cc rated 10,000V.
1 more element
A module for packaging semiconductors comprising:
- at least one PDC comprising parallel internal electrodes of alternating polarity with a paraelectric dielectric between adjacent internal electrodes wherein said paraelectric dielectric has a permittivity above 10 to no more than 300;
- wherein said PDC forms a capacitor couple with at least one semiconductor device;
- with said module having a peak operational temperature in a range from 150 to 300° C.
Dependencies are inferred from the claim text.