Perpendicular STTM free layer including protective cap
AssigneeIntel Corporation
InventorsKaan Oguz, Kevin P. OBrien, Brian S. Doyle, Charles C. Kuo, Mark L. Doczy
Life of this patent
Estimating the term…
Loading patent…
AssigneeIntel Corporation
InventorsKaan Oguz, Kevin P. OBrien, Brian S. Doyle, Charles C. Kuo, Mark L. Doczy
Estimating the term…
A perpendicular spin transfer torque memory (pSTTM) device incorporates a magnetic tunnel junction (MTJ) device having a free magnetic stack and a fixed magnetic stack separated by a dielectric tunneling layer. The free magnetic stack includes an uppermost magnetic layer that is at least partially covered by a cap layer. The cap layer is at least partially covered by a protective layer containing at least one of: ruthenium (Ru); cobalt/iron/boron (CoFeB); molybdenum (Mo); cobalt (Co); tungsten (W); or platinum (Pt). The protective layer is at least partially covered by a cap metal layer which may form a portion of MTJ electrode. The protective layer minimizes the occurrence of physical and/or chemical attack of the cap layer by the materials used in the cap metal layer, beneficially improving the interface anisotropy of the MTJ free magnetic layer.
A magnetic tunnel junction (MTJ) free magnetic stack, comprising:
A magnetic tunnel junction (MTJ) free magnetic stack manufacturing method, comprising:
A perpendicular spin transfer torque memory (pSTTM) device that includes a magnetic tunnel junction (MTJ) storage device, the pSTTM device comprising:
A magnetic tunnel junction (MTJ) free magnetic stack manufacturing system, comprising:
Dependencies are inferred from the claim text.