Backside illuminated image sensor and method of manufacturing the same
AssigneeDB HiTek Co., Ltd.
InventorsChang Hun Han, Sang Won Yun
Life of this patent
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Abstract
A backside illuminated image sensor includes pixel regions disposed in a substrate, an insulating layer disposed on a frontside surface of the substrate, a bonding pad disposed on a frontside surface of the insulating layer, and an anti-reflective layer disposed on a backside surface of the substrate. The substrate has a first opening for partially exposing a backside surface of the bonding pad, the insulating layer has a second opening for partially exposing the backside surface of the bonding pad, and the anti-reflective layer has a first portion extending along an inner side surface of the first opening.
Claims9
A backside illuminated image sensor comprising:
- a plurality of pixel regions disposed in a substrate defining a frontside surface and a backside surface;
- an insulating layer defining a frontside surface and disposed on the frontside surface of the substrate;
- a bonding pad disposed on the frontside surface of the insulating layer;
- and
- an anti-reflective layer disposed on the backside surface of the substrate,
- wherein the substrate defines a first opening for partially exposing a backside surface of the bonding pad, the insulating layer defines a second opening for partially exposing the backside surface of the bonding pad, and the anti-reflective layer has a first portion extending along an inner side surface of the first opening, and
- a second bonding pad is disposed on the anti-reflective layer, an inner side surface of the second opening and a backside surface portion of the bonding pad exposed by the second opening, and a third bonding pad made of a material different from the second bonding pad is disposed on the second bonding pad.
Dependencies are inferred from the claim text.