Image pickup element, method of manufacturing image pickup element, and electronic apparatus
AssigneeSony Corporation
InventorsShuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Abstract
An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
Claims20
An imaging device, comprising:
- a first photoelectric conversion region disposed in a substrate;
- a second photoelectric conversion region adjacent to the first photoelectric conversion region in the substrate;
- a trench disposed between the first photoelectric conversion region and the second photoelectric conversion region;
- a first film including silicon oxide disposed in the trench and directly contacting a wall surface of the trench;
- a second film including aluminum oxide disposed in the trench and above the first film;
- a third film including hafnium oxide disposed in the trench and above the second film;
- and
- a fourth film including tantalum oxide disposed in the trench and above the third film.
Dependencies are inferred from the claim text.