Package structure including at least one connecting module and manufacturing method thereof

A manufacturing method of a package structure, comprising:

• providing a carrier;
• forming a redistribution structure on the carrier, the redistribution structure comprising:
• a conductive pattern;
• and
• a dielectric layer, disposed on the conductive pattern and having a plurality of first openings to expose the conductive pattern;
• disposing a plurality of dies and a plurality of connecting modules on the redistribution structure, each of the connecting modules having a protection layer, a plurality of conductive caps, a plurality of barrier layers, a plurality of conductive bars, and a plurality of conductive bumps, wherein:
• the plurality of conductive caps, the plurality of barrier layers, and the plurality of conductive bars are embedded in the protection layer;
• the plurality of conductive bars are disposed on and directly contact the plurality of conductive bumps;
• the plurality of barrier layers are disposed on and directly contact the plurality of conductive bars;
• the plurality of conductive caps are disposed on and directly contact the plurality of barrier layers;
• a material of the conductive bars is different from a material of the conductive caps;
• the material of the conductive bars comprises copper;
• the material of the conductive caps does not comprise copper;
• and
• the connecting modules are disposed on the redistribution structure through a picked-and-placed process such that the plurality of conductive bumps are embedded within the plurality of first openings of the dielectric layer to directly contact to the conductive pattern and a side wall of the plurality of first openings;
• forming a first insulating encapsulant to encapsulate the dies and the connecting modules, wherein a portion of the first insulating encapsulant is disposed between the redistribution structure and the connecting module to directly contact a portion of the side wall of the plurality of conductive bumps, and there is no interface in the first insulating encapsulant;
• removing the carrier from the redistribution structure;
• forming a plurality of second openings in the protection layer of the connecting modules, wherein:
• one of the plurality of conductive caps, one of the plurality of bather layers, one of the plurality of conductive bars, and one of the plurality of conductive bumps are disposed corresponding to each of the plurality of second openings;
• and
• the plurality of second openings of the protection layer exposes at least a portion of each conductive cap;
• disposing a chip stack on the dies and the first insulating encapsulant opposite to the redistribution structure;
• forming a plurality of conductive wires, wherein the chip stack is electrically connected to the connecting modules through the plurality of conductive wires, and the plurality of conductive wires extend into the second openings of the protection layer to directly contact to the plurality of conductive caps;
• and
• encapsulating the chip stack by a second insulating encapsulant, wherein the plurality of conductive wires are embedded in the second insulating encapsulant.