Printed circuit board and package structure
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKee-Su Jeon, Min-Jae Seong
Life of this patent
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Abstract
A printed circuit board includes an insulating material with a bump pad buried in one surface, an adhesive layer stacked on the one surface of the insulating material, an insulating layer stacked on the adhesive layer, and a cavity passing through both of the adhesive layer and the insulating layer to expose the bump pad, wherein the cavity has a cross-sectional area decreasing in a direction toward the insulating material.
Claims22
A printed circuit board comprising:
- an insulating material comprising a bump pad buried in one surface;
- an adhesive layer stacked on the one surface of the insulating material;
- an insulating layer stacked on the adhesive layer;
- a cavity passing through both of the adhesive layer and the insulating layer to expose the bump pad,
- wherein the cavity is configured to accommodate an electronic element such that a distance between the one surface of the insulating material and a top of the electronic component is less than a sum of thicknesses of the adhesive layer, the insulating layer, and the electronic element, and
- wherein the cavity comprises a cross-sectional area decreasing in a direction toward the insulating material in both the adhesive layer and the insulating layer.
A package structure in which an upper package and a lower package are bonded, the lower package comprising a printed circuit board with an electronic element mounted thereon, wherein the printed circuit board comprises:
- an insulating material comprising a bump pad buried in one surface;
- an adhesive layer stacked on the one surface of the insulating material;
- an insulating layer stacked on the adhesive layer;
- a cavity passing through both of the adhesive layer and the insulating layer to expose the bump pad
- wherein the cavity comprises a cross-sectional area decreasing in a direction toward the insulating material in both the adhesive layer and the insulating layer, and
- wherein the electronic element is located inside the cavity and bonded to the bump pad such that a distance between the one surface of the insulating material and a top of the electronic component is less than a sum of thicknesses of the adhesive layer, the insulating layer, and the electronic element.
Dependencies are inferred from the claim text.