Semiconductor device assemblies with lids including circuit elements
AssigneeMicron Technology, Inc.
InventorThomas H. Kinsley
Life of this patent
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Abstract
A semiconductor device package is provided. The semiconductor device package includes a stack of semiconductor dies over a substrate, the substrate including a plurality of electrical contacts, and an annular lower lid disposed over the substrate and surrounding the stack of semiconductor dies. The annular lower lid includes a lower surface coupled to the substrate, an upper surface coupled to an upper lid, and an outer surface in which is formed an opening. The semiconductor device assembly further includes a circuit element disposed in the opening and electrically coupled to at least a first one of the plurality of electrical contacts. The semiconductor device assembly further includes the upper lid disposed over the annular lower lid and the stack of semiconductor dies.
Claims18
A semiconductor device package, comprising:
- a substrate including a plurality of electrical contacts;
- at least one semiconductor die over the substrate;
- an annular lower lid disposed over the substrate and surrounding the at least one semiconductor die, the annular lower lid including a lower surface coupled to the substrate, an upper surface coupled to an upper lid, and an outer surface in which is formed at least one opening;
- one or more circuit elements disposed in the at least one opening and electrically coupled to at least a first one of the plurality of electrical contacts;
- and
- the upper lid disposed over the annular lower lid and the at least one semiconductor die.
A semiconductor device package, comprising:
- a substrate including a plurality of electrical contacts;
- at least one semiconductor die over the substrate;
- a lid disposed over the substrate and surrounding at least one semiconductor die, the lid including a lower surface coupled to the substrate, an upper surface above the at least one semiconductor die, and an outer surface in which is formed at least one opening;
- one or more circuit elements disposed in the at least one opening and electrically coupled to at least a first one of the plurality of electrical contacts.
A semiconductor device assembly, comprising:
- a semiconductor device package, including:
- a substrate including a plurality of electrical contacts,
- at least one semiconductor die over the substrate,
- a lid disposed over the substrate and surrounding at least one semiconductor die, the lid including a lower surface coupled to the substrate, an upper surface above the at least one semiconductor die, and an outer surface in which is formed at least one opening, and
- a first circuit element disposed in the at least one opening and electrically coupled to at least a first one of the plurality of electrical contacts;
- and
- a second circuit element disposed outside of the semiconductor device package and configured to wirelessly communicate with the first circuit element.
Dependencies are inferred from the claim text.