Integrated circuit package and method of forming same

A method comprising:

• forming a first die structure, the first die structure comprising a die stack bonded to a carrier;
• forming a second die structure, the second die structure comprising a first integrated circuit die;
• bonding the first die structure to the second die structure by bonding a topmost integrated circuit die of the die stack to the first integrated circuit die, the topmost integrated circuit die of the die stack being a farthest integrated circuit die of the die stack from the carrier;
• bonding a first dummy structure to the second die structure adjacent the first die structure;
• encapsulating the first die structure in a first encapsulant;
• and
• performing a singulation process on the second die structure to form a plurality of individual die structures, wherein the singulation process singulates the first dummy structure into a plurality of individual dummy structures.

A method comprising:

• forming a first die structure, wherein forming the first die structure comprises:
• attaching a front side of a first integrated circuit die to a first carrier;
• encapsulating the first integrated circuit die in a first encapsulant;
• attaching a front side of a second integrated circuit die to a backside of the first integrated circuit die;
• and
• encapsulating the second integrated circuit die in a second encapsulant;
• forming a second die structure, wherein forming the second die structure comprises:
• attaching a front side of a third integrated circuit die to a second carrier;
• and
• encapsulating the third integrated circuit die in a third encapsulant;
• bonding the first die structure to the second die structure, wherein bonding the first die structure to the second die structure comprises bonding the second integrated circuit die to the third integrated circuit die;
• bonding a first dummy structure to the second die structure adjacent the first die structure;
• encapsulating the first die structure and the first dummy structure in a fourth encapsulant;
• and
• performing a dicing process on the second die structure to form a plurality of individual die structures, wherein the dicing process dices the first dummy structure and the third encapsulant.