Semiconductor device, semiconductor package and method of manufacturing the same

A semiconductor package comprising:

• a first semiconductor chip comprising:
• a first substrate comprising a first via hole;
• a first insulation interlayer disposed on a first surface the first substrate, and comprising:
• a first bonding pad interposed between a plurality of surfaces of the first insulation interlayer;
• and
• a second via hole connected to the first via hole and exposing the first bonding pad;
• a first plug structures disposed within the first via hole and the second via hole, and in contact with the first bonding pad;
• and
• an insulation layer disposed on a second surface of the first substrate, and comprising a second bonding pad interposed between a plurality of surfaces of the insulation layer, the second bonding pad being in contact with the first plug structure;
• and
• a second semiconductor chip stacked on the first semiconductor chip, and comprising a third bonding pad bonded to the second bonding pad that is exposed from one of the plurality of surfaces of the insulation layer of the first semiconductor chip, wherein the third bonding pad is in contact with the second bending pad, and each of the second bonding pad and the third bonding pad comprises a same metal material.