Package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTzuan-Horng Liu, Hsien-Wei Chen, Jiun-Heng Wang, Ming-Fa Chen
Life of this patent
Estimating the term…
Abstract
A package structure includes a substrate, a first die, a second die and a bonding die. The substrate comprises scribe regions and die regions. The die regions are spaced from each other by the scribe regions therebetween. The first die and the second die are within the die regions of the substrate. The bonding die is electrically bonded to the first die and the second die. The top surfaces of the first die and the second die are partially covered by the bonding die.
Claims20
A package structure, comprising:
- a substrate comprising scribe regions and die regions, the die regions are spaced from each other by the scribe regions therebetween;
- a first die and a second die within the die regions of the substrate, wherein the first die comprises a first dielectric structure and a first bonding pad embedded in the first dielectric structure, the second die comprises a second dielectric structure and a second bonding pad embedded in the second dielectric structure;
- and
- a bonding die, comprising a dielectric layer and third bonding pads embedded in the dielectric layer, wherein the bonding die is bonded to the first die and the second die through electrically bonding the third bonding pads to the first bonding pad and the second bonding pad, and bonding the dielectric layer to portions of the first dielectric structure and the second dielectric structure,
- wherein top surfaces of the first die and the second die are partially covered by the bonding die.
A package structure, comprising:
- a substrate comprising scribe regions and die regions, the die regions are spaced from each other by the scribe regions therebetween;
- a plurality of dies within the die regions of the substrate;
- a plurality of bonding dies, disposed on and electrically bonded to the plurality of dies;
- a gap fill structure on the substrate and laterally aside the plurality of bonding dies;
- and
- a plurality of conductive through dielectric vias, penetrating through the gap fill structure to electrically connect to the plurality of dies.
A package structure, comprising:
- a plurality of dies within die regions of a substrate, and spaced from each other by scribe regions of the substrate;
- a plurality of bonding dies across the scribe regions and electrically bonded to the plurality of dies;
- and
- a gap fill structure, disposed over the plurality of dies and laterally aside the plurality of bonding dies, wherein portions of top surfaces of the plurality of dies are covered by and in physical contact with the gap fill structure,
- wherein the scribe regions are remained in the package structure, and the plurality of bonding dies cover portions of top surfaces of the scribe regions and another portions of the top surfaces of the plurality of dies.
Dependencies are inferred from the claim text.