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US 10,950,574 B2Granted
Sensor having system-in-package module, method for producing the same, and sensor arrangement
AssigneeContinental Teves AG & Co. oHG
InventorsManfred Goll, Martin Haverkamp, Michael Schulmeister
Life of this patent
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Abstract
A sensor including a system-in-package module, wherein electrical contacts can be contact-connected by way of a mating connector. An associated method and an associated sensor arrangement are also disclosed.
Claims18
A sensor, comprising:
- a wafer-level system-in-package module comprising a number of electrical components supported on a film or a substrate, an encapsulation at least partially surrounding the number of electrical components supported on the film or the substrate, and a number of electrical connection lines for the electrical components,
- wherein
- the wafer-level system-in-package module has a number of electrical contacts,
- wherein each connection line is connected to an electrical contact, and
- wherein the electrical contacts can be contact-connected by way of a mating connector.
2 more elements
A method for producing a wafer-level system-in-package module, comprising:
- providing a film or a substrate, wherein the substrate has a printed electrical circuit,
- applying a number of electrical components to the film or the substrate,
- applying a number of electrical contacts to the film or the substrate, and
- applying an encapsulation to the film or the substrate, at the wafer level, which encapsulation covers the electrical components applied to the film or the substrate and partially covers the electrical contacts applied to the film or the substrate to produce the wafer-level system-in-package module.
1 more element
A sensor arrangement, comprising:
- a sensor including a wafer-level system-in-package module comprising a number of electrical components supported on a film or a substrate, an encapsulation at least partially surrounding the number of electrical components supported on the film or the substrate, and a number of electrical connection lines for the electrical components,
- wherein the wafer-level system-in-package module has a number of electrical contacts, each connection line is connected to an electrical contact, and the electrical contacts can be contact-connected by way of
- a mating connector, which is received in a connector region of a housing of the sensor.
Dependencies are inferred from the claim text.