Die bonder and methods of using the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Shing-Chao Chen, Chung-Shi Liu, Ming-Da Cheng
Life of this patent
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Abstract
A method includes bringing into contact respective first sides of a plurality of dies and a die attach film on a major surface of a carrier wafer, and simultaneously heating portions of the die attach film contacting the plurality of dies in order to simultaneously bond the plurality of dies to the die attach film.
Claims20
An apparatus for attaching a plurality of dies to a die-attach-film, the apparatus comprising:
- a pick-and-place unit for placing the plurality of dies laterally adjacent to each other on a first surface;
- a heating unit configured to hold a carrier substrate with the die-attach-film, the heating unit being configured to heat the die-attach-film;
- and
- a transfer arm configured to transfer the heating unit to the plurality of dies, wherein the heating unit has the carrier substrate and the die-attach-film attached thereto during the transfer, the transfer arm being configured to simultaneously attach the plurality of dies to the die-attach-film.
An apparatus for attaching a plurality of dies to a die-attach-film, the apparatus comprising:
- a first loading port configured to load a carrier and a die-attach film on the carrier to a first position inside a bonder;
- a second loading port configured to load a sawed wafer comprising the plurality of dies to a second position inside the bonder;
- a pick-and-place head configured to pick up the plurality of dies from the sawed wafer at the second position and place the plurality of dies laterally adjacent to each other at a third position;
- a vacuum head comprising a heating unit;
- and
- a transfer arm unit configured to swivel the vacuum head to and away from the third position, the vacuum head having the carrier and the die-attach film while the vacuum head is swiveled to and away from the third position.
An apparatus for attaching a plurality of dies to a die-attach-film, the apparatus comprising:
- a first space in a bonder, the first space is configured to hold a carrier and a die-attach film on the carrier;
- a second space in the bonder, the second space is configured to hold a plurality of dies;
- a pick-and-place head configured to transfer the plurality of dies from the second space to a third space;
- and
- a heating unit configured to, after the plurality of dies are transferred, heating the die-attach film and simultaneously placing the die-attach film on top of the plurality of dies.
Dependencies are inferred from the claim text.