Semiconductor device assembly with surface-mount die support structures

A semiconductor device assembly, comprising:

• a first package element;
• a second package element disposed over the first package element, the second package element including a plurality of conductive features and a passivation material configured to provide electrical isolation between the conductive features;
• a plurality of die support structures between the first and second package elements, wherein each of the plurality of die support structures is a monolithic structure with a first height, a lower surface mounted to the first package element and an upper surface in direct contact with the passivation material of the second package element, and is electrically isolated from other circuit elements of the semiconductor device assembly;
• and
• a plurality of interconnects between the first and second package elements, wherein each of the plurality of interconnects includes a first conductive element on the first package element, a second conductive element on one of the plurality of conductive features of the second package element, and a bond material between the first and second conductive elements,
• wherein each of the plurality of die support structures has a greater width than each of the plurality of interconnects, and
• wherein at least one of the plurality of die support structures includes a discrete capacitor electrically connected to other circuit elements in the first package element.