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US 10,950,563 B2Granted
Chip packages and methods for forming the same
AssigneeShunsin Technology (Zhong Shan) Limited
InventorWang-Lai Yang
Life of this patent
Estimating the term…
Abstract
A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.
Claims9
A chip package comprising:
- a substrate;
- a semiconductor element on the substrate, and coupled to the substrate through a first conductive element;
- a first colloid body on the substrate and covering the semiconductor element;
- an optical element in direct physical contact with the first colloid body and coupled to the substrate through a second conductive element;
- and
- a second colloid body on the first colloid body and covering the optical element, wherein the second colloid body is in direct physical contact with both the first colloid body and the optical element.
3 more elements
Dependencies are inferred from the claim text.