Impedance-matched through-wafer transition using integrated heat-spreader technology

A method of manufacturing a microwave electronic component, the method comprising:

• fabricating a substrate having top and bottom substrate surfaces;
• the substrate comprising an aperture between the top and bottom substrate surfaces;
• positioning in said aperture a microwave integrated circuit having a top circuit surface with at least one microwave signal port such that the top circuit surface and top substrate surface are flush;
• filling the remainder of said aperture with a metallic heat sink such that at least a bottom surface of said microwave integrated circuit is in contact with the metallic heat sink;
• forming a signal line comprising at least a metallic via between the top and bottom substrate surfaces, and a top signal conductor arranged between the microwave signal port and the metallic via;
• wherein the dimensions and location of the metallic via are chosen such that the metallic via forms, together with the metallic heat sink, a first impedance-matched non-coaxial transmission line.