Antenna module
AssigneeSamsung Electronics Co., Ltd.
InventorsHyung Mi Jung, Kyoung Ok Jung, Guk Hee Jung
Life of this patent
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Abstract
An antenna module includes an antenna substrate including a glass substrate having first and second surfaces opposing each other, an antenna pattern disposed on the first surface, and a wiring structure connected to the antenna pattern and extending to the second surface, and a semiconductor package including a semiconductor chip, having an inactive surface and an active surface, on which a connection pad is disposed, an encapsulant encapsulating the semiconductor chip, a connection member including a redistribution layer connected to the connection pad, and a through-via penetrating the encapsulant and connecting the redistribution layer and the wiring structure to each other.
Claims2
An antenna module comprising:
- an antenna substrate including a glass substrate having a first surface and a second surface opposing each other, an antenna pattern disposed on the first surface, a wiring pattern disposed on the second surface, and a first through-via connecting the antenna pattern and the wiring pattern to each other, wherein the first through-via has a smaller area as the first through-via gets closer to the first surface of the glass substrate;
- at least one passive component disposed on the second surface of the glass substrate, and connected to at least one of a first and a second redistribution layers;
- and
- a semiconductor package disposed on the antenna substrate, wherein the semiconductor package comprises:
- a first connection member disposed on the second surface of the glass substrate, and including the first redistribution layer connected to the wiring pattern, wherein the first redistribution layer includes a redistribution pattern and a redistribution via, and the redistribution via has a smaller area as the redistribution via gets closer to the glass substrate,
- a semiconductor chip disposed on the first connection member, and including a connection pad connected to the first redistribution layer,
- an encapsulant disposed on the first connection member and encapsulating the semiconductor chip and the at least one passive component,
- a second connection member disposed on the encapsulant, and including the second redistribution layer, and
- a second through-via penetrating the encapsulant and connecting the first redistribution layer and the second redistribution layer to each other, wherein the second through-via has a second smaller area as the second through-via gets closer to the first redistribution layer.
Dependencies are inferred from the claim text.