EMI shielding structure in InFO package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKai-Chiang Wu, Chen-Hua Yu, Ching-Feng Yang, Meng-Tse Chen
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Abstract
A method includes forming a metal post over a first dielectric layer, attaching a second dielectric layer over the first dielectric layer, encapsulating a device die, the second dielectric layer, a shielding structure, and the metal post in an encapsulating material, planarizing the encapsulating material to reveal the device die, the shielding structure, and the metal post, and forming an antenna electrically coupling to the device die. The antenna has a portion vertically aligned to a portion of the device die.
Claims20
A device comprising:
- a dielectric plate;
- a device die;
- an encapsulating material;
- a shielding structure encapsulated in the encapsulating material, wherein the device die is in the shielding structure, and wherein both of the device die and the shielding structure are underlying the dielectric plate;
- a through-via penetrating through the encapsulating material, wherein the through-via extends from a top-surface-level of the dielectric plate down to a bottom-surface-level of the device die;
- and
- an antenna having at least a portion overlapping the shielding structure, wherein the antenna is electrically connected to the device die through the through-via.
A device comprising:
- a molding compound;
- a metal cap comprising:
- a top portion;
- and
- a first plurality of conductive posts underlying and connected to the top portion, wherein the metal cap is electrically grounded, and wherein the metal cap penetrates through the molding compound;
- a second plurality of conductive posts penetrating through the molding compound;
- a first patch antenna electrically coupling to one of the second plurality of conductive posts, wherein the first patch antenna overlaps the metal cap;
- and
- a second patch antenna overlapping the first patch antenna, wherein the second patch antenna is electrically floating.
A device comprising:
- a dielectric plate;
- a device die underlying the dielectric plate;
- a first plurality of conductive posts encircling the device die;
- a second plurality of conductive posts, wherein the second plurality of conductive posts extend from a first level of a top surface of the dielectric plate to a second level of bottom surfaces of the first plurality of conductive posts;
- an encapsulant encapsulating the dielectric plate, the device die, the first plurality of conductive posts, and the second plurality of conductive posts therein;
- and
- an antenna comprising a first portion overlapping a second portion of the dielectric plate, wherein the antenna is electrically connected to the device die.
Dependencies are inferred from the claim text.