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US 10,950,554 B2Granted
Semiconductor packages with electromagnetic interference shielding layer and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Kuo-Chung Yee, Chun-Hui Yu
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Abstract
Semiconductor packages and methods of forming the same are provided. a semiconductor package includes a sub-package, a second die and a second molding layer. The sub-package includes a first die, a first molding layer aside the first die and a first redistribution layer structure disposed over the first die and the first molding layer and electrically connected to the first die. The second die is disposed over the sub-package, wherein the first die and the second die are disposed on opposite surfaces of the first redistribution layer structure. The second molding layer encapsulates the sub-package and the second die.
Claims20
A semiconductor package, comprising:
- a sub-package, comprising a first die, a first molding layer aside the first die and a first redistribution layer structure disposed over the first die and the first molding layer and electrically connected to the first die;
- a second die disposed aside the sub-package;
- a first electromagnetic interference shielding layer, wherein the first electromagnetic interference shielding layer is continuous on and in physical and direct contact with all sides of the second die;
- a second molding layer, encapsulating the sub-package and the second die;
- a second electromagnetic interference shielding layer covering the sub-package and the second molding layer;
- and
- a first adhesive layer between the second die and the second electromagnetic interference shielding layer, wherein a first portion of the first electromagnetic interference shielding layer on a top surface of the second die is in physical and direct contact with the first adhesive layer, and a second portion of the first electromagnetic interference shielding layer on the top surface of the second die is in physical and direct contact with the second electromagnetic interference shielding layer.
4 more elements
A semiconductor package, comprising:
- a sub-package, comprising a first die, a first molding layer aside the first die and a first redistribution layer structure disposed over the first die and the first molding layer and electrically connected to the first die;
- a second die, disposed aside the sub-package and comprising a first electromagnetic interference shielding layer covering thereover;
- a second molding layer, encapsulating the sub-package and the second die;
- a second electromagnetic interference shielding layer covering the sub-package and the second molding layer;
- and
- a first adhesive layer, wherein a surface of the sub-package, a surface of the second molding layer and a surface of the first electromagnetic interference shielding layer on a top surface of the second die are substantially coplanar with each other and are in physical and direct contact with the first adhesive layer, wherein a first portion of the first electromagnetic interference shielding layer on the top surface of the second die is in physical and direct contact with the first adhesive layer, and a second portion of the first electromagnetic interference shielding layer on the top surface of the second die is in physical and direct contact with the second electromagnetic interference shielding layer.
3 more elements
A method of forming a semiconductor package, comprising:
- providing a sub-package onto a carrier through a first adhesive layer, wherein the sub-package comprises a first die, a first molding layer aside the first die and a first redistribution layer structure disposed over the first die and the first molding layer and electrically connected to the first die;
- forming a second die aside the sub-package on the first adhesive layer;
- forming a first electromagnetic interference shielding layer, wherein the first electromagnetic interference shielding layer is continuous on and in physical and direct contact with all sides of the second die;
- forming a second molding layer to encapsulate the sub-package and the second die;
- and
- forming a second electromagnetic interference shielding layer covering the sub-package and the second molding layer, wherein the first adhesive layer is disposed between the second die and the second electromagnetic interference shielding layer, a first portion of the first electromagnetic interference shielding layer on a top surface of the second die is in physical and direct contact with the first adhesive layer, and a second portion of the first electromagnetic interference shielding layer on the top surface of the second die is in physical and direct contact with the second electromagnetic interference shielding layer.
3 more elements
Dependencies are inferred from the claim text.