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US 10,950,551 B2Granted
Embedded component package structure and manufacturing method thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYu-Ju Liao, Chien-Fan Chen, Chien-Hao Wang
Life of this patent
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Abstract
An embedded component package structure including a dielectric structure and a component is provided. The component is embedded in the dielectric structure and is provided with a plurality of conductive pillars. The conductive pillars are exposed from an upper surface of the dielectric structure and have a first thickness and a second thickness, respectively, and the first thickness is not equal to the second thickness.
Claims20
An embedded component package structure, comprising:
- a dielectric structure;
- and
- an component embedded in the dielectric structure, wherein the component is provided with a plurality of conductive pillars, the conductive pillars being exposed from an upper surface of the dielectric structure and each conductive pillar having a first height and a second height respectively, wherein the first height is not equal to the second height.
An embedded component package structure, comprising:
- a dielectric structure;
- and
- a component embedded in the dielectric structure, wherein the component is provided with a plurality of conductive pillars, wherein each of the conductive pillars has a center line, the center lines have a first inclined angle and a second inclined angle with respect to a vertical line, and the first inclined angle is not equal to the second inclined angle.
Dependencies are inferred from the claim text.