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US 10,950,538 B2Granted
Semiconductor structure and manufacturing method thereof
AssigneeNanya Technology Corporation
InventorShing-Yih Shih
Life of this patent
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Abstract
A semiconductor structure includes a substrate; a die disposed over the substrate; a molding surrounding the die; a dielectric layer disposed over the substrate and surrounding the die and the molding; a conductive via extending through the dielectric layer; and a metallic strip extending through and along the dielectric layer to at least partially surround the die.
Claims13
A semiconductor structure, comprising:
- a substrate;
- a die disposed over the substrate;
- a molding surrounding the die;
- a dielectric layer disposed over the substrate and encircling the die and the molding along outer sidewalls and corners of the molding;
- a conductive via extending vertically through the dielectric layer;
- and
- a metallic strip extending vertically through the dielectric layer and extending horizontally along the outer sidewalls and corners of the molding to horizontally cover the outer sidewalls and corners of the molding.
4 more elements
Dependencies are inferred from the claim text.